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Rochester Electronics FS15R06VE3B2BOMA1
Manufacturer # :FS15R06VE3B2BOMA1
Manufacturer :Rochester Electronics
Dasenic # :FS15R06VE3B2BOMA1-DS
Datasheet : FS15R06VE3B2BOMA1 Datasheet
Customer # :
Description : IGBT MODULE 600V 22A 65W
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1527
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 16.704
Total :$ 16.70
Delivery :
Payment :
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FS15R06VE3B2BOMA1 information
Rochester Electronics FS15R06VE3B2BOMA1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
- Product Status:Not For New Designs
- Operating Temperature:-40°C ~ 150°C
- Mounting Type:Chassis Mount
- Package / Case:Module
- Power - Max:65 W
- Supplier Device Package:Module
- Configuration:Three Phase Inverter
- Input:Standard
- Current - Collector ( Ic) ( Max):22 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- Current - Collector Cutoff ( Max):1 mA
- I G B T Type:-
- Vce(on) ( Max) @ Vge, Ic:2V @ 15V, 15A
- Input Capacitance ( Cies) @ Vce:830 pF @ 25 V
- N T C Thermistor:Yes
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.29.0095
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FS15R06VE3B2BOMA1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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