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Rochester Electronics FPF2C8P2NL07A
INSULATED GATE BIPOLAR TRANSISTO
Manufacturer # :FPF2C8P2NL07A
Manufacturer :Rochester Electronics
Dasenic # :FPF2C8P2NL07A-DS
Datasheet :
FPF2C8P2NL07A Datasheet
FPF2C8P2NL07A DatasheetCustomer # :
Description : INSULATED GATE BIPOLAR TRANSISTO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 35+ | $ 12.0060 | $ 420.21 |
In Stock: 4410
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 12.006
Total :$ 12.01
Delivery :
Payment :
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FPF2C8P2NL07A information
Rochester Electronics FPF2C8P2NL07A technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
- Product Status:Active
- Operating Temperature:-40°C ~ 150°C (TJ)
- Mounting Type:Chassis Mount
- Package / Case:F2 Module
- Power - Max:135 W
- Supplier Device Package:F2
- Configuration:Three Phase
- Input:Standard
- Current - Collector ( Ic) ( Max):30 A
- Voltage - Collector Emitter Breakdown ( Max):650 V
- Current - Collector Cutoff ( Max):250 µA
- I G B T Type:Field Stop
- Vce(on) ( Max) @ Vge, Ic:2.2V @ 15V, 30A
- Input Capacitance ( Cies) @ Vce:-
- N T C Thermistor:Yes
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FPF2C8P2NL07A provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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