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1 : $41.0220
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Rochester Electronics FP50R06W2E3B11BOMA1
IGBT MODULE 600V 65A 175W
Manufacturer # :FP50R06W2E3B11BOMA1
Manufacturer :Rochester Electronics
Dasenic # :FP50R06W2E3B11BOMA1-DS
Datasheet :
FP50R06W2E3B11BOMA1 Datasheet
FP50R06W2E3B11BOMA1 DatasheetCustomer # :
Description : IGBT MODULE 600V 65A 175W
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 41.0220 | $ 41.02 |
| 25+ | $ 40.2030 | $ 1005.08 |
| 100+ | $ 38.5650 | $ 3856.5 |
| 500+ | $ 36.9180 | $ 18459 |
| 1000+ | $ 34.8660 | $ 34866 |
In Stock: 9138
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 41.022
Total :$ 41.02
Delivery :
Payment :
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FP50R06W2E3B11BOMA1 information
Rochester Electronics FP50R06W2E3B11BOMA1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
- Product Status:Active
- Operating Temperature:-40°C ~ 150°C
- Mounting Type:Chassis Mount
- Package / Case:Module
- Power - Max:175 W
- Supplier Device Package:Module
- Configuration:Three Phase Inverter
- Input:Standard
- Current - Collector ( Ic) ( Max):65 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- Current - Collector Cutoff ( Max):1 mA
- I G B T Type:Trench Field Stop
- Vce(on) ( Max) @ Vge, Ic:1.9V @ 15V, 50A
- Input Capacitance ( Cies) @ Vce:3.1 nF @ 25 V
- N T C Thermistor:Yes
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FP50R06W2E3B11BOMA1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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