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  • Rochester Electronics FP15R06W1E3B11BOMA1

    IGBT MODULE 600V 22A 81W
  • part number has RoHS
  • Mfr.Part # :FP15R06W1E3B11BOMA1
  • Manufacturer :Rochester Electronics
  • Dasenic # :FP15R06W1E3B11BOMA1-DS
  • Datasheet :pdf download FP15R06W1E3B11BOMA1 Datasheet
  • Description : IGBT MODULE 600V 22A 81W
  • Package :-
  • Quantity :
    Unit Price : $ 79.16Total : $ 79.16
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 1511
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 79.1600$ 79.16
24 +$ 53.9508$ 1294.82
48 +$ 79.1600$ 3799.68

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Rochester Electronics FP15R06W1E3B11BOMA1 technical specifications, attributes, parameters.
Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
Product Status:Active
Operating Temperature:-40°C ~ 150°C
Mounting Type:Chassis Mount
Package / Case:Module
Power - Max:81 W
Supplier Device Package:Module
Configuration:Three Phase Inverter
Input:Standard
Current - Collector ( Ic) ( Max):22 A
Voltage - Collector Emitter Breakdown ( Max):600 V
Current - Collector Cutoff ( Max):1 mA
I G B T Type:Trench Field Stop
Vce(on) ( Max) @ Vge, Ic:2V @ 15V, 15A
Input Capacitance ( Cies) @ Vce:830 pF @ 25 V
N T C Thermistor:Yes
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
FP15R06W1E3B11BOMA1 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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