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Rochester Electronics FP10R12W1T7PB3BPSA1

LOW POWER EASY
part number has RoHS
Manufacturer # :FP10R12W1T7PB3BPSA1
Manufacturer :Rochester Electronics
Dasenic # :FP10R12W1T7PB3BPSA1-DS
Customer # :
Description : LOW POWER EASY
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 30.6000$ 30.6
25+$ 29.9880$ 749.7
100+$ 28.7640$ 2876.4
500+$ 27.5400$ 13770
1000+$ 26.0100$ 26010
In Stock: 1530
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 30.6
Total :$ 30.60
Delivery :
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Payment :
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FP10R12W1T7PB3BPSA1 information

  • Rochester Electronics FP10R12W1T7PB3BPSA1 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Power - Max:-
  • Supplier Device Package:-
  • Configuration:-
  • Input:-
  • Current - Collector ( Ic) ( Max):-
  • Voltage - Collector Emitter Breakdown ( Max):-
  • Current - Collector Cutoff ( Max):-
  • I G B T Type:-
  • Vce(on) ( Max) @ Vge, Ic:-
  • Input Capacitance ( Cies) @ Vce:-
  • N T C Thermistor:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FP10R12W1T7PB3BPSA1 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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