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Rochester Electronics FM93C66ALM8X
EEPROM, 256X16, SERIAL, CMOS
Manufacturer # :FM93C66ALM8X
Manufacturer :Rochester Electronics
Dasenic # :FM93C66ALM8X-DS
Datasheet :
FM93C66ALM8X Datasheet
FM93C66ALM8X DatasheetCustomer # :
Description : EEPROM, 256X16, SERIAL, CMOS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.5481 | $ 0.55 |
| 9+ | $ 0.4568 | $ 4.11 |
| 40+ | $ 0.3654 | $ 14.62 |
| 149+ | $ 0.2558 | $ 38.11 |
| 705+ | $ 0.2284 | $ 161.02 |
In Stock: 32407
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5481
Total :$ 0.55
Delivery :
Payment :
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FM93C66ALM8X information
Rochester Electronics FM93C66ALM8X technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Technology:EEPROM
- Supplier Device Package:8-SOIC
- Memory Size:4Kb (512 x 8, 256 x 16)
- Memory Type:Non-Volatile
- Voltage - Supply:2.7V ~ 5.5V
- Clock Frequency:250 kHz
- Access Time:-
- Memory Format:EEPROM
- Memory Interface:SPI
- Write Cycle Time - Word, Page:15ms
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FM93C66ALM8X provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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