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Rochester Electronics FM27C010Q90

IC EPROM 1MBIT PARALLEL 32CDIP
part number has RoHS
Manufacturer # :FM27C010Q90
Manufacturer :Rochester Electronics
Dasenic # :FM27C010Q90-DS
Customer # :
Description : IC EPROM 1MBIT PARALLEL 32CDIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.8980$ 2.9
100+$ 2.6951$ 269.51
1000+$ 2.6082$ 2608.2
10000+$ 2.4633$ 24633
In Stock: 14091
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.898
Total :$ 2.90
Delivery :
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FM27C010Q90 information

  • Rochester Electronics FM27C010Q90 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Through Hole
  • Package / Case:32-CDIP (0.685", 17.40mm) Window
  • Technology:EPROM - UV
  • Supplier Device Package:32-CDIP
  • Memory Size:1Mb (128K x 8)
  • Memory Type:Non-Volatile
  • Voltage - Supply:4.5V ~ 5.5V
  • Clock Frequency:-
  • Access Time:90 ns
  • Memory Format:EPROM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:-
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:Vendor omitted MSL Rating information
  • US ECCN:EAR99
  • HTS US:8542.32.0061
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FM27C010Q90 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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