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1 : $1.7190
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Rochester Electronics FM25V05-G
IC FRAM 512KBIT SPI 40MHZ 8SOIC
Manufacturer # :FM25V05-G
Manufacturer :Rochester Electronics
Dasenic # :FM25V05-G-DS
Datasheet :
FM25V05-G Datasheet
FM25V05-G DatasheetCustomer # :
Description : IC FRAM 512KBIT SPI 40MHZ 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 27+ | $ 1.7190 | $ 46.41 |
| 56+ | $ 1.6083 | $ 90.06 |
| 87+ | $ 1.5525 | $ 135.07 |
| 125+ | $ 1.4418 | $ 180.23 |
| 163+ | $ 1.3860 | $ 225.92 |
In Stock: 29622
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.719
Total :$ 1.72
Delivery :
Payment :
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FM25V05-G information
Rochester Electronics FM25V05-G technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Technology:FRAM (Ferroelectric RAM)
- Supplier Device Package:8-SOIC
- Memory Size:512Kb (64K x 8)
- Memory Type:Non-Volatile
- Voltage - Supply:2V ~ 3.6V
- Clock Frequency:40 MHz
- Access Time:-
- Memory Format:FRAM
- Memory Interface:SPI
- Write Cycle Time - Word, Page:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FM25V05-G provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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