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Rochester Electronics FM22LD16-55-BG

IC FRAM 4MBIT PARALLEL 48FBGA
part number has RoHS
Manufacturer # :FM22LD16-55-BG
Manufacturer :Rochester Electronics
Dasenic # :FM22LD16-55-BG-DS
Customer # :
Description : IC FRAM 4MBIT PARALLEL 48FBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 30.8790$ 30.88
25+$ 30.2580$ 756.45
100+$ 29.0250$ 2902.5
500+$ 27.7920$ 13896
1000+$ 26.2440$ 26244
In Stock: 3045
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 30.879
Total :$ 30.88
Delivery :
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Payment :
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FM22LD16-55-BG information

  • Rochester Electronics FM22LD16-55-BG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-TFBGA
  • Technology:FRAM (Ferroelectric RAM)
  • Supplier Device Package:48-FBGA (6x8)
  • Memory Size:4Mb (256K x 16)
  • Memory Type:Non-Volatile
  • Voltage - Supply:2.7V ~ 3.6V
  • Clock Frequency:-
  • Access Time:110 ns
  • Memory Format:FRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:110ns
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.32.0071
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FM22LD16-55-BG provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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