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Rochester Electronics FJV3110RMTF-ON
Manufacturer # :FJV3110RMTF-ON
Manufacturer :Rochester Electronics
Dasenic # :FJV3110RMTF-ON-DS
Datasheet : FJV3110RMTF-ON Datasheet
Customer # :
Description : 0.1A, 40V, NPN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1410
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.108
Total :$ 0.11
Delivery :
Payment :
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FJV3110RMTF-ON information
Rochester Electronics FJV3110RMTF-ON technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single, Pre-Biased
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:TO-236-3, SC-59, SOT-23-3
- Power - Max:200 mW
- Supplier Device Package:SOT-23-3
- Transistor Type:NPN - Pre-Biased
- Current - Collector ( Ic) ( Max):100 mA
- Voltage - Collector Emitter Breakdown ( Max):40 V
- Vce Saturation ( Max) @ Ib, Ic:300mV @ 1mA, 10mA
- Current - Collector Cutoff ( Max):100nA (ICBO)
- D C Current Gain (h F E) ( Min) @ Ic, Vce:100 @ 1mA, 5V
- Frequency - Transition:250 MHz
- Resistor - Base ( R1):10 kOhms
- Resistor - Emitter Base ( R2):-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:0000.00.0000
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FJV3110RMTF-ON provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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