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Rochester Electronics FCM8531QY

MICROPROCESSOR CIRCUIT, CMOS, PQ
part number has RoHS
Manufacturer # :FCM8531QY
Manufacturer :Rochester Electronics
Dasenic # :FCM8531QY-DS
Customer # :
Description : MICROPROCESSOR CIRCUIT, CMOS, PQ
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 6.1650$ 61.65
2500+$ 3.4250$ 8562.5
In Stock: 1301
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.165
Total :$ 6.17
Delivery :
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Payment :
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FCM8531QY information

  • Rochester Electronics FCM8531QY technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Motor Drivers, Controllers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:32-LQFP
  • Technology:-
  • Interface:I²C, SPI
  • Supplier Device Package:32-LQFP (7x7)
  • Voltage - Supply:4.5V ~ 5.5V
  • Current - Output:-
  • Output Configuration:Pre-Driver - Half Bridge (3)
  • Voltage - Load:-
  • Motor Type - Stepper:-
  • Motor Type - A C, D C:Brushless DC (BLDC)
  • Step Resolution:-
  • Applications:General Purpose
  • Function:Controller - Commutation, Direction Management
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FCM8531QY provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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