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  • Rochester Electronics FAN7081MX

    BUFFER/INVERTER MOSFET DRIVER
  • part number has RoHS
  • Mfr.Part # :FAN7081MX
  • Manufacturer :Rochester Electronics
  • Dasenic # :FAN7081MX-DS
  • Datasheet :pdf download FAN7081MX Datasheet
  • Description : BUFFER/INVERTER MOSFET DRIVER
  • Package :-
  • Quantity :
    Unit Price : $ 0.81Total : $ 0.81
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 29112
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 0.8100$ 0.81
25 +$ 0.7938$ 19.85
100 +$ 0.7614$ 76.14
500 +$ 0.7290$ 364.50
1000 +$ 0.6885$ 688.50

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Rochester Electronics FAN7081MX technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Gate Drivers
Product Status:Active
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:8-SOIC (0.154", 3.90mm Width)
Input Type:Inverting
Supplier Device Package:8-SOIC
Voltage - Supply:10V ~ 20V
Channel Type:Single
Driven Configuration:High-Side
Number of Drivers:1
Gate Type:IGBT, N-Channel, P-Channel MOSFET
Logic Voltage - V I L, V I H:8V, 12.6V
Current - Peak Output ( Source, Sink):250mA, 500mA
High Side Voltage - Max ( Bootstrap):600 V
Rise / Fall Time ( Typ):15ns, 10ns
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
FAN7081MX provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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