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Rochester Electronics EPX740LC68-15Z
OT PLD, 18NS, CMOS, PQCC68
Manufacturer # :EPX740LC68-15Z
Manufacturer :Rochester Electronics
Dasenic # :EPX740LC68-15Z-DS
Datasheet :
EPX740LC68-15Z Datasheet
EPX740LC68-15Z DatasheetCustomer # :
Description : OT PLD, 18NS, CMOS, PQCC68
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 9.5940 | $ 9.59 |
| 25+ | $ 9.4050 | $ 235.13 |
| 100+ | $ 9.0180 | $ 901.8 |
| 500+ | $ 8.6310 | $ 4315.5 |
| 1000+ | $ 8.1540 | $ 8154 |
In Stock: 3720
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.594
Total :$ 9.59
Delivery :
Payment :
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EPX740LC68-15Z information
Rochester Electronics EPX740LC68-15Z technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:68-LCC (J-Lead)
- Supplier Device Package:68-PLCC (24x24)
- Programmable Type:EPLD
- Delay Time tpd(1) Max:15 ns
- Voltage Supply - Internal:4.75V ~ 5.25V
- Number of Logic Elements/ Blocks:16
- Number of Macrocells:40
- Number of I/ O:-
- Number of gates:800
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EPX740LC68-15Z provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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