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1 : $2.5716
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Rochester Electronics EPM7064BTI44-7
EE PLD, 3.5NS, 64-CELL PQFP44
Manufacturer # :EPM7064BTI44-7
Manufacturer :Rochester Electronics
Dasenic # :EPM7064BTI44-7-DS
Datasheet :
EPM7064BTI44-7 Datasheet
EPM7064BTI44-7 DatasheetCustomer # :
Description : EE PLD, 3.5NS, 64-CELL PQFP44
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.5716 | $ 2.57 |
| 200+ | $ 0.9951 | $ 199.02 |
| 500+ | $ 0.9608 | $ 480.4 |
| 1000+ | $ 0.9437 | $ 943.7 |
In Stock: 2796
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.5716
Total :$ 2.57
Delivery :
Payment :
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EPM7064BTI44-7 information
Rochester Electronics EPM7064BTI44-7 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:44-TQFP
- Supplier Device Package:44-TQFP (10x10)
- Programmable Type:EE PLD
- Delay Time tpd(1) Max:7.5 ns
- Voltage Supply - Internal:2.375V ~ 2.625V
- Number of Logic Elements/ Blocks:4
- Number of Macrocells:64
- Number of I/ O:36
- Number of gates:1250
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EPM7064BTI44-7 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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