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Rochester Electronics EPM5032JM-25
UV PLD, 25NS, PAL-TYPE
Manufacturer # :EPM5032JM-25
Manufacturer :Rochester Electronics
Dasenic # :EPM5032JM-25-DS
Datasheet :
EPM5032JM-25 Datasheet
EPM5032JM-25 DatasheetCustomer # :
Description : UV PLD, 25NS, PAL-TYPE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 35.0600 | $ 35.06 |
| 25+ | $ 34.3600 | $ 859 |
| 100+ | $ 32.9600 | $ 3296 |
| 500+ | $ 31.5600 | $ 15780 |
| 1000+ | $ 29.8000 | $ 29800 |
In Stock: 1515
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 35.06
Total :$ 35.06
Delivery :
Payment :
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EPM5032JM-25 information
Rochester Electronics EPM5032JM-25 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C (TC)
- Mounting Type:Surface Mount
- Package / Case:28-CLCC Window (J-Lead)
- Supplier Device Package:28-JLCC
- Programmable Type:EE PLD
- Delay Time tpd(1) Max:25 ns
- Voltage Supply - Internal:4.5V ~ 5.5V
- Number of Logic Elements/ Blocks:1
- Number of Macrocells:32
- Number of I/ O:24
- Number of gates:600
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EPM5032JM-25 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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