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Rochester Electronics EP610DM-30
EP610 - CLASSIC FAMILY EPLD, LOG
Manufacturer # :EP610DM-30
Manufacturer :Rochester Electronics
Dasenic # :EP610DM-30-DS
Datasheet :
EP610DM-30 Datasheet
EP610DM-30 DatasheetCustomer # :
Description : EP610 - CLASSIC FAMILY EPLD, LOG
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 218.7400 | $ 218.74 |
| 25+ | $ 214.3600 | $ 5359 |
| 100+ | $ 205.6200 | $ 20562 |
| 500+ | $ 196.8600 | $ 98430 |
| 1000+ | $ 185.9200 | $ 185920 |
In Stock: 1505
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 218.74
Total :$ 218.74
Delivery :
Payment :
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EP610DM-30 information
Rochester Electronics EP610DM-30 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 125°C (TC)
- Mounting Type:Through Hole
- Package / Case:24-CDIP
- Supplier Device Package:24-CDIP
- Programmable Type:EPLD
- Delay Time tpd(1) Max:30 ns
- Voltage Supply - Internal:4.5V ~ 5.5V
- Number of Logic Elements/ Blocks:-
- Number of Macrocells:16
- Number of I/ O:22
- Number of gates:300
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EP610DM-30 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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