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Rochester Electronics EP600LC-3

OT PLD, 45NS, PAL-TYPE PQCC28
part number has RoHS
Manufacturer # :EP600LC-3
Manufacturer :Rochester Electronics
Dasenic # :EP600LC-3-DS
Customer # :
Description : OT PLD, 45NS, PAL-TYPE PQCC28
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 17.3250$ 17.33
25+$ 16.9740$ 424.35
100+$ 16.2810$ 1628.1
500+$ 15.5880$ 7794
1000+$ 14.7240$ 14724
In Stock: 8016
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.325
Total :$ 17.32
Delivery :
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Payment :
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EP600LC-3 information

  • Rochester Electronics EP600LC-3 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:28-LCC (J-Lead)
  • Supplier Device Package:28-PLCC
  • Programmable Type:EPLD
  • Delay Time tpd(1) Max:43 ns
  • Voltage Supply - Internal:4.75V ~ 5.25V
  • Number of Logic Elements/ Blocks:-
  • Number of Macrocells:16
  • Number of I/ O:16
  • Number of gates:-
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:Vendor omitted MSL Rating information
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
EP600LC-3 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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