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Rochester Electronics EM773FHN33,551
Manufacturer # :EM773FHN33,551
Manufacturer :Rochester Electronics
Dasenic # :EM773FHN33,551-DS
Datasheet : EM773FHN33,551 Datasheet
Customer # :
Description : IC MCU 32BIT 32KB FLASH 32HVQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6646
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.439
Total :$ 2.44
Delivery :
Payment :
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EM773FHN33,551 information
Rochester Electronics EM773FHN33,551 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:32-VQFN Exposed Pad
- Supplier Device Package:32-HVQFN (7x7)
- Peripherals:Brown-out Detect/Reset, POR, WDT
- Number of I/ O:25
- Speed:48MHz
- E E P R O M Size:-
- Core Processor:ARM® Cortex®-M0
- R A M Size:8K x 8
- Program Memory Type:Flash
- Core Size:32-Bit Single-Core
- Connectivity:I²C, SPI, UART/USART
- Program Memory Size:32KB (32K x 8)
- Voltage - Supply ( Vcc/ Vdd):1.8V ~ 3.6V
- Data Converters:-
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.31.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
EM773FHN33,551 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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