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Rochester Electronics EC3101C-TL
BIP PNP 0.15A 50V
Manufacturer # :EC3101C-TL
Manufacturer :Rochester Electronics
Dasenic # :EC3101C-TL-DS
Datasheet :
EC3101C-TL Datasheet
EC3101C-TL DatasheetCustomer # :
Description : BIP PNP 0.15A 50V
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.0512 | $ 0.05 |
| 25+ | $ 0.0502 | $ 1.26 |
| 100+ | $ 0.0482 | $ 4.82 |
| 500+ | $ 0.0461 | $ 23.05 |
| 1000+ | $ 0.0436 | $ 43.6 |
In Stock: 48048
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0512
Total :$ 0.05
Delivery :
Payment :
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EC3101C-TL information
Rochester Electronics EC3101C-TL technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single
- Product Status:Active
- Operating Temperature:-
- Mounting Type:-
- Package / Case:-
- Power - Max:-
- Supplier Device Package:-
- Transistor Type:-
- Current - Collector ( Ic) ( Max):-
- Voltage - Collector Emitter Breakdown ( Max):-
- Vce Saturation ( Max) @ Ib, Ic:-
- Current - Collector Cutoff ( Max):-
- D C Current Gain (h F E) ( Min) @ Ic, Vce:-
- Frequency - Transition:-
- EU RoHS Status:RoHS Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- HTS US:8541.21.0075
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EC3101C-TL provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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