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Rochester Electronics DSD1794DB
IC DAC/AUDIO 24BIT 200K 28SSOP
Manufacturer # :DSD1794DB
Manufacturer :Rochester Electronics
Dasenic # :DSD1794DB-DS
Datasheet :
DSD1794DB Datasheet
DSD1794DB DatasheetCustomer # :
Description : IC DAC/AUDIO 24BIT 200K 28SSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 14.7060 | $ 14.71 |
| 25+ | $ 14.4090 | $ 360.23 |
| 100+ | $ 13.8240 | $ 1382.4 |
| 500+ | $ 13.2300 | $ 6615 |
| 1000+ | $ 12.5010 | $ 12501 |
In Stock: 1725
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 14.706
Total :$ 14.71
Delivery :
Payment :
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DSD1794DB information
Rochester Electronics DSD1794DB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
- Product Status:Obsolete
- Operating Temperature:-25°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:28-SSOP (0.209", 5.30mm Width)
- Type:DAC, Audio
- Number of Channels:3
- Supplier Device Package:28-SSOP
- Voltage - Supply:-
- Resolution ( Bits):24 b
- Sampling Rate ( Per Second):200k
- Data Interface:DSD, PCM
- Voltage Supply Source:Analog and Digital
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DSD1794DB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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