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Rochester Electronics DSD1791DB
IC DAC/AUDIO 24BIT 200K 28SSOP
Manufacturer # :DSD1791DB
Manufacturer :Rochester Electronics
Dasenic # :DSD1791DB-DS
Datasheet :
DSD1791DB Datasheet
DSD1791DB DatasheetCustomer # :
Description : IC DAC/AUDIO 24BIT 200K 28SSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 4.2120 | $ 4.21 |
| 25+ | $ 4.1310 | $ 103.28 |
| 100+ | $ 3.9600 | $ 396 |
| 500+ | $ 3.7890 | $ 1894.5 |
| 1000+ | $ 3.5820 | $ 3582 |
In Stock: 1927
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.212
Total :$ 4.21
Delivery :
Payment :
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DSD1791DB information
Rochester Electronics DSD1791DB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
- Product Status:Active
- Operating Temperature:-25°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:28-SSOP (0.209", 5.30mm Width)
- Type:DAC, Audio
- Number of Channels:2
- Supplier Device Package:28-SSOP
- Voltage - Supply:3V ~ 3.6V, 5V
- Resolution ( Bits):24 b
- Sampling Rate ( Per Second):200k
- Data Interface:DSD, PCM
- Voltage Supply Source:Analog and Digital
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DSD1791DB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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