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Rochester Electronics DS3252+

IC TELECOM INTERFACE 144CSBGA
part number has RoHS
Manufacturer # :DS3252+
Manufacturer :Rochester Electronics
Dasenic # :DS3252+-DS
Customer # :
Description : IC TELECOM INTERFACE 144CSBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 40.3920$ 40.39
25+$ 39.5820$ 989.55
100+$ 37.9710$ 3797.1
500+$ 36.3510$ 18175.5
1000+$ 34.3350$ 34335
In Stock: 1980
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 40.392
Total :$ 40.39
Delivery :
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Payment :
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DS3252+ information

  • Rochester Electronics DS3252+ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Telecom
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:144-BGA, CSPBGA
  • Current - Supply:150mA
  • Interface:LIU
  • Supplier Device Package:144-TECSBGA (13x13)
  • Number of Circuits:2
  • Power ( Watts):-
  • Voltage - Supply:3.3V
  • Function:Line Interface Unit (LIU)
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:4 (72 Hours)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
DS3252+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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