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1 : $105.6780
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Rochester Electronics DS3172N+
IC TELECOM INTERFACE 400BGA
Manufacturer # :DS3172N+
Manufacturer :Rochester Electronics
Dasenic # :DS3172N+-DS
Datasheet :
DS3172N+ Datasheet
DS3172N+ DatasheetCustomer # :
Description : IC TELECOM INTERFACE 400BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 3+ | $ 105.6780 | $ 317.03 |
In Stock: 7704
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 105.678
Total :$ 105.68
Delivery :
Payment :
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DS3172N+ information
Rochester Electronics DS3172N+ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Telecom
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:400-BBGA
- Current - Supply:328mA
- Interface:DS3, E3
- Supplier Device Package:400-PBGA (27x27)
- Number of Circuits:2
- Power ( Watts):-
- Voltage - Supply:3.135V ~ 3.465V
- Function:Single-Chip Transceiver
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:5A991B1
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
DS3172N+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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