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Rochester Electronics DS3170N

IC TELECOM INTERFACE 100CSBGA
part number has RoHS
Manufacturer # :DS3170N
Manufacturer :Rochester Electronics
Dasenic # :DS3170N-DS
Customer # :
Description : IC TELECOM INTERFACE 100CSBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 98.7200$ 98.72
25+$ 96.7400$ 2418.5
100+$ 92.8000$ 9280
500+$ 88.8400$ 44420
1000+$ 83.9200$ 83920
In Stock: 1513
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 98.72
Total :$ 98.72
Delivery :
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DS3170N information

  • Rochester Electronics DS3170N technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Telecom
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA, CSBGA
  • Current - Supply:120mA
  • Interface:DS3, E3
  • Supplier Device Package:100-CSBGA (11x11)
  • Number of Circuits:1
  • Power ( Watts):-
  • Voltage - Supply:3.135V ~ 3.465V
  • Function:Single-Chip Transceiver
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
DS3170N provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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