Name: DS3151NB1
Brand: Rochester Electronics
SKU: DS-5741344
Price: 31.167 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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1 : $31.1670

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Rochester Electronics DS3151NB1

IC TELECOM INTERFACE 144CSBGA

Manufacturer # :DS3151NB1

Manufacturer :Rochester Electronics

Dasenic # :DS3151NB1-DS

Datasheet :

DS3151NB1 Datasheet

Customer # :

Customer #

Description : IC TELECOM INTERFACE 144CSBGA

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Quantity	Unit Price	Total
1+	$ 31.1670	$ 31.17
25+	$ 30.5460	$ 763.65
100+	$ 29.2950	$ 2929.5
500+	$ 28.0530	$ 14026.5
1000+	$ 26.4960	$ 26496

In Stock: 3132

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 31.167

Total :$ 31.17

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DS3151NB1 information

Rochester Electronics DS3151NB1 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Interface - Telecom
Product Status:Obsolete
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:144-BGA, CSPBGA
Current - Supply:75mA
Interface:LIU
Supplier Device Package:144-TECSBGA (13x13)
Number of Circuits:1
Power ( Watts):-
Voltage - Supply:3.135V ~ 3.465V
Function:Line Interface Unit (LIU)
EU RoHS Status:RoHS non-compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
US ECCN:EAR99
HTS US:8542.39.0001
REACH Status:Vendor is not defined
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Rochester Electronics DS3151NB1
Datasheet:
DS3151NB1,

Rochester Electronics DS3151NB1 Environmental and export classification status description
The Maxim Integrated DS3151NB1 is part of the DS315x family of devices and is an Integrated Circuit (IC) designed for networking applications, specifically for use in line cards and packet-processing applications. Functions: 1. It provides clock and data recovery (CDR) functionality. 2. Supports data rates up to 12.5Gbps. 3. It includes features for advanced diagnostics and digital control. Applications: 1. Networking equipment such as routers and switches. 2. Telecommunications systems. 3. Data centers. 4. High-speed communication systems. Alternative Components: 1. DS3150NB1 - Another member of the DS315x family with similar functionalities. 2. TI SN65HVD3085E - A CAN (Controller Area Network) transceiver with similar data rate capabilities. Embedded Modules: 1. High-speed data interfaces. 2. Diagnostics and control features. 3. Clock and data recovery circuitry. --- Related Q&A: 1. What are the key features of the Maxim Integrated DS3151NB1? - The key features include clock and data recovery, support for high data rates, advanced diagnostics, and digital control capabilities. 2. How does the DS3151NB1 compare to other networking ICs in terms of performance? - The DS3151NB1 offers high-speed data processing and advanced diagnostic features that make it suitable for demanding networking applications. 3. Can the DS3151NB1 be used in both wired and wireless networking applications? - While primarily designed for wired networking applications, the DS3151NB1 can also be adapted for certain wireless networking applications that require high data rate processing. 4. What are some typical use cases for the DS3151NB1 in the field of telecommunications? - The DS3151NB1 is commonly used in high-speed data networking equipment deployed in telecommunications systems to ensure reliable data transmission and reception. 5. Are there any development kits available for prototyping designs using the DS3151NB1? - Maxim Integrated may offer evaluation kits or development tools that allow engineers to prototype and test circuits incorporating the DS3151NB1 before final product deployment.

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DS3151NB1 provided by Rochester Electronics

As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.