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Rochester Electronics DS2770BE+
IC BATT MFUNC MULTI-CHEM 16TSSOP
Manufacturer # :DS2770BE+
Manufacturer :Rochester Electronics
Dasenic # :DS2770BE+-DS
Datasheet :
DS2770BE+ Datasheet
DS2770BE+ DatasheetCustomer # :
Description : IC BATT MFUNC MULTI-CHEM 16TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 10.2400 | $ 10.24 |
| 25+ | $ 10.0400 | $ 251 |
| 100+ | $ 9.6200 | $ 962 |
| 500+ | $ 9.2200 | $ 4610 |
| 1000+ | $ 8.7000 | $ 8700 |
In Stock: 1512
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 10.24
Total :$ 10.24
Delivery :
Payment :
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DS2770BE+ information
Rochester Electronics DS2770BE+ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Battery Management
- Product Status:Obsolete
- Operating Temperature:-20°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:16-TSSOP (0.173", 4.40mm Width)
- Battery Chemistry:Multi-Chemistry
- Number of Cells:-
- Interface:1-Wire
- Supplier Device Package:16-TSSOP
- Fault Protection:-
- Function:Multi-Function Controller
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
DS2770BE+ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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