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Rochester Electronics DS1743-85+

IC RTC CLK/CALENDAR PAR 28-EDIP
part number has RoHS
Manufacturer # :DS1743-85+
Manufacturer :Rochester Electronics
Dasenic # :DS1743-85+-DS
Customer # :
Description : IC RTC CLK/CALENDAR PAR 28-EDIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 14.5260$ 14.53
10+$ 13.9450$ 139.45
100+$ 13.0734$ 1307.34
1000+$ 12.9281$ 12928.1
10000+$ 12.7829$ 127829
In Stock: 48650
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 14.526
Total :$ 14.53
Delivery :
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Payment :
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DS1743-85+ information

  • Rochester Electronics DS1743-85+ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Real Time Clocks
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Features:Leap Year, NVSRAM, Y2K
  • Mounting Type:Through Hole
  • Package / Case:28-DIP Module (0.600", 15.24mm)
  • Type:Clock/Calendar
  • Interface:Parallel
  • Supplier Device Package:28-EDIP
  • Memory Size:8KB
  • Voltage - Supply:4.5V ~ 5.5V
  • Time Format:HH:MM:SS (24 hr)
  • Date Format:YY-MM-DD-dd
  • Voltage - Supply, Battery:-
  • Current - Timekeeping ( Max):3mA @ 5V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DS1743-85+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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