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Rochester Electronics DS1344D-3+

IC RTC CLK/CAL SPI 14TDFN
part number has RoHS
Manufacturer # :DS1344D-3+
Manufacturer :Rochester Electronics
Dasenic # :DS1344D-3+-DS
Customer # :
Description : IC RTC CLK/CAL SPI 14TDFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 14.8400$ 14.84
10+$ 13.4000$ 134
50+$ 12.7800$ 639
100+$ 11.1000$ 1110
200+$ 10.6000$ 2120
In Stock: 517
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 14.84
Total :$ 14.84
Delivery :
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DS1344D-3+ information

  • Rochester Electronics DS1344D-3+ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Real Time Clocks
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Features:Alarm, Leap Year, NVRAM, Square Wave Output, Trickle Charger
  • Mounting Type:Surface Mount
  • Package / Case:14-WFDFN Exposed Pad
  • Type:Clock/Calendar
  • Interface:SPI
  • Supplier Device Package:14-TDFN (3x3)
  • Memory Size:96B
  • Voltage - Supply:2.7V ~ 5.5V
  • Time Format:HH:MM:SS (12/24 hr)
  • Date Format:YY-MM-DD-dd
  • Voltage - Supply, Battery:1.3V ~ 5.5V
  • Current - Timekeeping ( Max):-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DS1344D-3+ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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