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Rochester Electronics DS1306

IC RTC CLK/CALENDAR SPI 16-DIP
part number has RoHS
Manufacturer # :DS1306
Manufacturer :Rochester Electronics
Dasenic # :DS1306-DS
Customer # :
Description : IC RTC CLK/CALENDAR SPI 16-DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.8890$ 2.89
25+$ 2.8350$ 70.88
100+$ 2.7180$ 271.8
500+$ 2.6010$ 1300.5
1000+$ 2.4570$ 2457
In Stock: 1525
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.889
Total :$ 2.89
Delivery :
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DS1306 information

  • Rochester Electronics DS1306 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Real Time Clocks
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Features:Alarm, Leap Year, NVSRAM, Square Wave Output, Trickle-Charger
  • Mounting Type:Through Hole
  • Package / Case:16-DIP (0.300", 7.62mm)
  • Type:Clock/Calendar
  • Interface:SPI
  • Supplier Device Package:16-PDIP
  • Memory Size:96B
  • Voltage - Supply:2V ~ 5.5V
  • Time Format:HH:MM:SS (12/24 hr)
  • Date Format:YY-MM-DD-dd
  • Voltage - Supply, Battery:2V ~ 5.5V
  • Current - Timekeeping ( Max):25.3µA ~ 81µA @ 2V ~ 5V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DS1306 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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