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  • Rochester Electronics DS1306

    IC RTC CLK/CALENDAR SPI 16-DIP
  • part number has RoHS
  • Mfr.Part # :DS1306
  • Manufacturer :Rochester Electronics
  • Dasenic # :DS1306-DS
  • Datasheet :pdf download DS1306 Datasheet
  • Description : IC RTC CLK/CALENDAR SPI 16-DIP
  • Package :-
  • Quantity :
    Unit Price : $ 2.889Total : $ 2.89
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 1525
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 2.8890$ 2.89
25 +$ 2.8350$ 70.88
100 +$ 2.7180$ 271.80
500 +$ 2.6010$ 1300.50
1000 +$ 2.4570$ 2457.00

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Rochester Electronics DS1306 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Real Time Clocks
Product Status:Obsolete
Operating Temperature:0°C ~ 70°C
Features:Alarm, Leap Year, NVSRAM, Square Wave Output, Trickle-Charger
Mounting Type:Through Hole
Package / Case:16-DIP (0.300", 7.62mm)
Type:Clock/Calendar
Interface:SPI
Supplier Device Package:16-PDIP
Memory Size:96B
Voltage - Supply:2V ~ 5.5V
Time Format:HH:MM:SS (12/24 hr)
Date Format:YY-MM-DD-dd
Voltage - Supply, Battery:2V ~ 5.5V
Current - Timekeeping ( Max):25.3µA ~ 81µA @ 2V ~ 5V
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Green Symbol: Green and environmentally friendly product
DS1306 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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