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Rochester Electronics DS1305EN

IC RTC CLK/CALENDAR SPI 20-TSSOP
part number has RoHS
Manufacturer # :DS1305EN
Manufacturer :Rochester Electronics
Dasenic # :DS1305EN-DS
Customer # :
Description : IC RTC CLK/CALENDAR SPI 20-TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
40+$ 1.2132$ 48.53
80+$ 1.1349$ 90.79
125+$ 1.0962$ 137.03
180+$ 1.0179$ 183.22
230+$ 0.9783$ 225.01
In Stock: 6967
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.2132
Total :$ 1.21
Delivery :
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DS1305EN information

  • Rochester Electronics DS1305EN technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Real Time Clocks
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Features:Alarm, Leap Year, NVSRAM, Trickle-Charger
  • Mounting Type:Surface Mount
  • Package / Case:20-TSSOP (0.173", 4.40mm Width)
  • Type:Clock/Calendar
  • Interface:SPI
  • Supplier Device Package:20-TSSOP
  • Memory Size:96B
  • Voltage - Supply:2V ~ 5.5V
  • Time Format:HH:MM:SS (12/24 hr)
  • Date Format:YY-MM-DD-dd
  • Voltage - Supply, Battery:2V ~ 5.5V
  • Current - Timekeeping ( Max):25.3µA ~ 81µA @ 2V ~ 5V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DS1305EN provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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