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1 : $17.0069
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Rochester Electronics DS12R885S-33
IC BATT CHG RTC W/TRICKLE
Manufacturer # :DS12R885S-33
Manufacturer :Rochester Electronics
Dasenic # :DS12R885S-33-DS
Datasheet :
DS12R885S-33 Datasheet
DS12R885S-33 DatasheetCustomer # :
Description : IC BATT CHG RTC W/TRICKLE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 17.0069 | $ 17.01 |
| 25+ | $ 16.6372 | $ 415.93 |
| 100+ | $ 15.9717 | $ 1597.17 |
| 500+ | $ 15.3062 | $ 7653.1 |
| 1000+ | $ 14.4189 | $ 14418.9 |
In Stock: 6018
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.0069
Total :$ 17.01
Delivery :
Payment :
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DS12R885S-33 information
Rochester Electronics DS12R885S-33 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Battery Chargers
- Product Status:Active
- Operating Temperature:-
- Mounting Type:-
- Package / Case:-
- Battery Chemistry:-
- Number of Cells:-
- Charge Current - Max:-
- Interface:-
- Supplier Device Package:-
- Fault Protection:-
- Current - Charging:-
- Programmable Features:-
- Battery Pack Voltage:-
- Voltage - Supply ( Max):-
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DS12R885S-33 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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