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Rochester Electronics DS1251YP-70

IC RTC PHANTOM PAR 34-PCM
part number has RoHS
Manufacturer # :DS1251YP-70
Manufacturer :Rochester Electronics
Dasenic # :DS1251YP-70-DS
Customer # :
Description : IC RTC PHANTOM PAR 34-PCM
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 31.6710$ 31.67
25+$ 31.0410$ 776.03
100+$ 29.7720$ 2977.2
500+$ 28.5030$ 14251.5
1000+$ 26.9190$ 26919
In Stock: 1820
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 31.671
Total :$ 31.67
Delivery :
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Payment :
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DS1251YP-70 information

  • Rochester Electronics DS1251YP-70 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Real Time Clocks
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Features:Leap Year, NVSRAM
  • Mounting Type:Surface Mount
  • Package / Case:34-PowerCap™ Module
  • Type:Phantom Time Chip
  • Interface:Parallel
  • Supplier Device Package:34-PowerCap Module
  • Memory Size:512KB
  • Voltage - Supply:4.5V ~ 5.5V
  • Time Format:HH:MM:SS:hh (12/24 hr)
  • Date Format:YY-MM-DD-dd
  • Voltage - Supply, Battery:3V
  • Current - Timekeeping ( Max):10mA @ 5V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DS1251YP-70 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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