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1 : $1.5120
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Rochester Electronics DS1077LZ-40
IC OSC DUAL FX FREQ PROG 8-SOIC
Manufacturer # :DS1077LZ-40
Manufacturer :Rochester Electronics
Dasenic # :DS1077LZ-40-DS
Datasheet :
DS1077LZ-40 Datasheet
DS1077LZ-40 DatasheetCustomer # :
Description : IC OSC DUAL FX FREQ PROG 8-SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.5120 | $ 1.51 |
| 25+ | $ 1.4850 | $ 37.13 |
| 100+ | $ 1.4220 | $ 142.2 |
| 500+ | $ 1.3590 | $ 679.5 |
| 1000+ | $ 1.2870 | $ 1287 |
In Stock: 9090
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.512
Total :$ 1.51
Delivery :
Payment :
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DS1077LZ-40 information
Rochester Electronics DS1077LZ-40 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Programmable Timers and Oscillators
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Frequency:4.87kHz ~ 40MHz
- Current - Supply:15 mA
- Type:Oscillator, Fixed Frequency (Dual)
- Supplier Device Package:8-SOIC
- Voltage - Supply:2.7V ~ 3.6V
- Count:-
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
DS1077LZ-40 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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