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1 : $3.2940
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Rochester Electronics DS1013M-40
IC DELAY LINE 40NS 8DIP
Manufacturer # :DS1013M-40
Manufacturer :Rochester Electronics
Dasenic # :DS1013M-40-DS
Datasheet :
DS1013M-40 Datasheet
DS1013M-40 DatasheetCustomer # :
Description : IC DELAY LINE 40NS 8DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 3.2940 | $ 3.29 |
| 25+ | $ 3.2310 | $ 80.78 |
| 100+ | $ 3.0960 | $ 309.6 |
| 500+ | $ 2.9610 | $ 1480.5 |
| 1000+ | $ 2.7990 | $ 2799 |
In Stock: 4143
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.294
Total :$ 3.29
Delivery :
Payment :
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DS1013M-40 information
Rochester Electronics DS1013M-40 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Delay Lines
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Supplier Device Package:8-PDIP
- Voltage - Supply:4.75V ~ 5.25V
- Number of Taps/ Steps:-
- Delay to 1st Tap:40ns
- Tap Increment:-
- Available Total Delays:40ns
- Number of Independent Delays:3
- Function:Multiple, NonProgrammable
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
DS1013M-40 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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