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Rochester Electronics DRV8832QDGQQ1
Manufacturer # :DRV8832QDGQQ1
Manufacturer :Rochester Electronics
Dasenic # :DRV8832QDGQQ1-DS
Datasheet : DRV8832QDGQQ1 Datasheet
Customer # :
Description : IC MTR DRV BIPLR 2.75-6.8V 10SOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 5634
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.411
Total :$ 3.41
Delivery :
Payment :
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DRV8832QDGQQ1 information
Rochester Electronics DRV8832QDGQQ1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Motor Drivers, Controllers
- Product Status:Active
- Operating Temperature:-40°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:10-PowerTFSOP, 10-MSOP (0.118", 3.00mm Width)
- Technology:Power MOSFET
- Interface:Parallel
- Supplier Device Package:10-HVSSOP
- Voltage - Supply:2.75V ~ 6.8V
- Current - Output:1A
- Output Configuration:Half Bridge (2)
- Voltage - Load:2.75V ~ 6.8V
- Motor Type - Stepper:Bipolar
- Motor Type - A C, D C:Brushed DC
- Step Resolution:-
- Applications:Battery Powered
- Function:Driver - Fully Integrated, Control and Power Stage
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DRV8832QDGQQ1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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