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Rochester Electronics DRV8332DKD
Manufacturer # :DRV8332DKD
Manufacturer :Rochester Electronics
Dasenic # :DRV8332DKD-DS
Datasheet : DRV8332DKD Datasheet
Customer # :
Description : IC BRIDGE DRIVER PAR 36HSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6306
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.9714
Total :$ 7.97
Delivery :
Payment :
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DRV8332DKD information
Rochester Electronics DRV8332DKD technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Full, Half-Bridge Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 150°C (TJ)
- Features:Bootstrap Circuit, Status Flag
- Mounting Type:Surface Mount
- Package / Case:36-BSSOP (0.433", 11.00mm Width) Exposed Pad
- Technology:Power MOSFET
- Interface:PWM
- Supplier Device Package:36-HSSOP
- Voltage - Supply:10.8V ~ 13.2V
- Current - Output / Channel:8A
- Current - Peak Output:13A
- Fault Protection:Current Limiting, Over Temperature, Short Circuit, UVLO
- Output Configuration:Half Bridge (3)
- Load Type:Inductive
- Rds On ( Typ):80mOhm LS, 80mOhm HS
- Voltage - Load:0V ~ 52.5V
- Applications:DC Motors, General Purpose
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:4 (72 Hours)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DRV8332DKD provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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