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Rochester Electronics DRV104PWP
Manufacturer # :DRV104PWP
Manufacturer :Rochester Electronics
Dasenic # :DRV104PWP-DS
Datasheet : DRV104PWP Datasheet
Customer # :
Description : IC PWR DRIVER 1:1 14HTSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 9351
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.923
Total :$ 4.92
Delivery :
Payment :
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DRV104PWP information
Rochester Electronics DRV104PWP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Power Distribution Switches, Load Drivers
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C (TA)
- Features:Internal PWM, Status Flag
- Mounting Type:Surface Mount
- Package / Case:14-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Input Type:Non-Inverting
- Output Type:-
- Interface:On/Off
- Supplier Device Package:14-HTSSOP
- Ratio - Input: Output:1:1
- Voltage - Supply ( Vcc/ Vdd):Not Required
- Number of Outputs:1
- Fault Protection:Current Limiting (Fixed), Over Temperature
- Output Configuration:High Side
- Rds On ( Typ):-
- Voltage - Load:8V ~ 32V
- Current - Output ( Max):1.2A
- Switch Type:Relay, Solenoid Driver
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DRV104PWP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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