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  • Rochester Electronics DD1200S12H4

    DIODE MODULE 1200V 1200A
  • part number has RoHS
  • Mfr.Part # :DD1200S12H4
  • Manufacturer :Rochester Electronics
  • Dasenic # :DD1200S12H4-DS
  • Datasheet :pdf download DD1200S12H4 Datasheet
  • Description : DIODE MODULE 1200V 1200A
  • Package :-
  • Quantity :
    Unit Price : $ 1217.76Total : $ 1217.76
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 1103
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
2 +$ 1217.7600$ 2435.52
10 +$ 1217.7400$ 12177.40

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Rochester Electronics DD1200S12H4 technical specifications, attributes, parameters.
Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Arrays
Product Status:Active
Mounting Type:Chassis Mount
Package / Case:Module
Supplier Device Package:AG-IHMB130-2
Speed:Standard Recovery >500ns, > 200mA (Io)
Diode Type:Standard
Voltage - Forward ( Vf) ( Max) @ If:2.35 V @ 1200 A
Current - Reverse Leakage @ Vr:475 A @ 600 V
Diode Configuration:2 Independent
Voltage - D C Reverse ( Vr) ( Max):1200 V
Current - Average Rectified ( Io) (per Diode):-
Reverse Recovery Time (trr):-
Operating Temperature - Junction:-40°C ~ 150°C
EU RoHS Status:ROHS3 Compliant
MSL Rating:Vendor omitted MSL Rating information
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8541.10.0080
China RoHS Status:Green Symbol: Green and environmentally friendly product
DD1200S12H4 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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