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Rochester Electronics DCP010512BP
Manufacturer # :DCP010512BP
Manufacturer :Rochester Electronics
Dasenic # :DCP010512BP-DS
Datasheet : DCP010512BP Datasheet
Customer # :
Description : DC DC CONVERTER 12V 1W
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1744
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.721
Total :$ 8.72
Delivery :
Payment :
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DCP010512BP information
Rochester Electronics DCP010512BP technical specifications, attributes, parameters.
- Category:Board-Mount Power Supplies/DC DC Converters
- Product Status:Active
- Operating Temperature:-40°C ~ 100°C
- Features:OTP, SCP
- Mounting Type:Through Hole
- Package / Case:14-DIP (0.300", 7.62mm), 7 Leads
- Size / Dimension:0.78" L x 0.33" W x 0.21" H (19.7mm x 8.3mm x 5.3mm)
- Approval Agency:-
- Type:Isolated Module
- Voltage - Input ( Max):5.5V
- Supplier Device Package:7-PDIP
- Power ( Watts):1 W
- Number of Outputs:1
- Voltage - Isolation:1 kV
- Control Features:Enable, Active High
- Current - Output ( Max):83mA
- Voltage - Input ( Min):4.5V
- Voltage - Output 1:12V
- Voltage - Output 2:-
- Voltage - Output 3:-
- Voltage - Output 4:-
- Efficiency:85%
- Standard Number:-
- Applications:ITE (Commercial)
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DCP010512BP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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