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1 : $27.3150

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Rochester Electronics DAC8222FS

IC DAC 12BIT DUAL W/BUFF 24-SOIC
part number has RoHS
Manufacturer # :DAC8222FS
Manufacturer :Rochester Electronics
Dasenic # :DAC8222FS-DS
Customer # :
Description : IC DAC 12BIT DUAL W/BUFF 24-SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 27.3150$ 27.32
25+$ 26.7660$ 669.15
100+$ 25.6770$ 2567.7
500+$ 24.5880$ 12294
1000+$ 23.2200$ 23220
In Stock: 27893
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 27.315
Total :$ 27.32
Delivery :
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DAC8222FS information

  • Rochester Electronics DAC8222FS technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - Digital to Analog Converters (DAC)
  • Product Status:Obsolete
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:24-SOIC (0.295", 7.50mm Width)
  • Output Type:-
  • Supplier Device Package:24-SOIC
  • Data Interface:-
  • Number of Bits:-
  • Voltage - Supply, Analog:-
  • Voltage - Supply, Digital:-
  • Architecture:-
  • Reference Type:-
  • Number of D/ A Converters:-
  • Settling Time:-
  • Differential Output:-
  • I N L/ D N L ( L S B):-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DAC8222FS provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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