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1 : $102.5010
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Rochester Electronics CYV15G0404DXB-BGXC
IC TELECOM INTERFACE 256BGA
Manufacturer # :CYV15G0404DXB-BGXC
Manufacturer :Rochester Electronics
Dasenic # :CYV15G0404DXB-BGXC-DS
Datasheet :
CYV15G0404DXB-BGXC Datasheet
CYV15G0404DXB-BGXC DatasheetCustomer # :
Description : IC TELECOM INTERFACE 256BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 102.5010 | $ 102.5 |
| 25+ | $ 100.4490 | $ 2511.23 |
| 100+ | $ 96.3540 | $ 9635.4 |
| 500+ | $ 92.2500 | $ 46125 |
| 1000+ | $ 87.1290 | $ 87129 |
In Stock: 1525
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 102.501
Total :$ 102.50
Delivery :
Payment :
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CYV15G0404DXB-BGXC information
Rochester Electronics CYV15G0404DXB-BGXC technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Telecom
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:256-BGA Exposed Pad
- Current - Supply:900mA
- Interface:LVTTL
- Supplier Device Package:256-L2BGA (27x27)
- Number of Circuits:4
- Power ( Watts):-
- Voltage - Supply:3.135V ~ 3.465V
- Function:-
- EU RoHS Status:ROHS3 Compliant
- US ECCN:5A991B1
- HTS US:8542.39.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CYV15G0404DXB-BGXC provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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