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Rochester Electronics CYV15G0204TRB-BGC

IC SERDES HOTLINK 256LBGA
part number has RoHS
Manufacturer # :CYV15G0204TRB-BGC
Manufacturer :Rochester Electronics
Dasenic # :CYV15G0204TRB-BGC-DS
Customer # :
Description : IC SERDES HOTLINK 256LBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 28.7550$ 28.76
25+$ 28.1790$ 704.48
100+$ 27.0270$ 2702.7
500+$ 25.8840$ 12942
1000+$ 24.4440$ 24444
In Stock: 1580
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 28.755
Total :$ 28.75
Delivery :
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Payment :
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CYV15G0204TRB-BGC information

  • Rochester Electronics CYV15G0204TRB-BGC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Serializers, Deserializers
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:256-BGA Exposed Pad
  • Input Type:LVTTL
  • Output Type:PECL
  • Supplier Device Package:256-L2BGA (27x27)
  • Voltage - Supply:3.3V
  • Number of Inputs:20/4
  • Data Rate:1.485Gbps
  • Number of Outputs:4/20
  • Function:Serializer/Deserializer
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:5 (48 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:5A991B1
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CYV15G0204TRB-BGC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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