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Rochester Electronics CYUSB3314-BVXC

IC USB 3.0 HUB 4-PORT 100BGA
part number has RoHS
Manufacturer # :CYUSB3314-BVXC
Manufacturer :Rochester Electronics
Dasenic # :CYUSB3314-BVXC-DS
Customer # :
Description : IC USB 3.0 HUB 4-PORT 100BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 5.1210$ 5.12
25+$ 5.0220$ 125.55
100+$ 4.8150$ 481.5
500+$ 4.6080$ 2304
1000+$ 4.3560$ 4356
In Stock: 5607
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.121
Total :$ 5.12
Delivery :
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Payment :
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CYUSB3314-BVXC information

  • Rochester Electronics CYUSB3314-BVXC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microcontrollers - Application Specific
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:100-VFBGA
  • Interface:I²C
  • Supplier Device Package:100-VFBGA (6x6)
  • Voltage - Supply:1.14V ~ 1.26V, 2.5V ~ 2.7V, 3V ~ 3.6V
  • Number of I/ O:10
  • Core Processor:ARM® Cortex®-M0
  • R A M Size:16K x 8
  • Program Memory Type:ROM (32kB)
  • Controller Series:CYUSB
  • Applications:USB 3.0 Hub Controller
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CYUSB3314-BVXC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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