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Rochester Electronics CYUSB3031-BZXC

IC USB CTLR
part number has RoHS
Manufacturer # :CYUSB3031-BZXC
Manufacturer :Rochester Electronics
Dasenic # :CYUSB3031-BZXC-DS
Customer # :
Description : IC USB CTLR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 17.7390$ 17.74
25+$ 17.3880$ 434.7
100+$ 16.6770$ 1667.7
500+$ 15.9660$ 7983
1000+$ 15.0750$ 15075
In Stock: 1594
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.739
Total :$ 17.74
Delivery :
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CYUSB3031-BZXC information

  • Rochester Electronics CYUSB3031-BZXC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microcontrollers - Application Specific
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:121-TFBGA
  • Interface:GPIF, I²C, I²S, MMC/SD/SDIO, SPI, UART
  • Supplier Device Package:121-FBGA (10x10)
  • Voltage - Supply:1.15V ~ 1.25V
  • Number of I/ O:60
  • Core Processor:ARM9®
  • R A M Size:256K x 8
  • Program Memory Type:External Program Memory
  • Controller Series:CYUSB
  • Applications:USB Host/Peripheral Controller
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CYUSB3031-BZXC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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