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Rochester Electronics CYUSB2024-BZXI
Manufacturer # :CYUSB2024-BZXI
Manufacturer :Rochester Electronics
Dasenic # :CYUSB2024-BZXI-DS
Datasheet : CYUSB2024-BZXI Datasheet
Customer # :
Description : IC USB CTLR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 5040
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.2212
Total :$ 11.22
Delivery :
Payment :
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CYUSB2024-BZXI information
Rochester Electronics CYUSB2024-BZXI technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers - Application Specific
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:121-TFBGA
- Interface:I²C, I²S, MMC/SD, SPI, UART, USB
- Supplier Device Package:121-FBGA (10x10)
- Voltage - Supply:1.15V ~ 1.25V
- Number of I/ O:59
- Core Processor:ARM9®
- R A M Size:512K x 8
- Program Memory Type:-
- Controller Series:CYUSB
- Applications:SD2™ USB and Mass Storage Peripheral Controller
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:3A991A2
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CYUSB2024-BZXI provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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