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Rochester Electronics CYRF69213A-40LTXC

IC PROC 8K FLASH 40QFN
part number has RoHS
Manufacturer # :CYRF69213A-40LTXC
Manufacturer :Rochester Electronics
Dasenic # :CYRF69213A-40LTXC-DS
Customer # :
Description : IC PROC 8K FLASH 40QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.6630$ 3.66
25+$ 3.5910$ 89.78
100+$ 3.4470$ 344.7
500+$ 3.2940$ 1647
1000+$ 3.1140$ 3114
In Stock: 1560
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.663
Total :$ 3.66
Delivery :
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Payment :
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CYRF69213A-40LTXC information

  • Rochester Electronics CYRF69213A-40LTXC technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Transceiver ICs
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:40-VFQFN Exposed Pad
  • Frequency:-
  • Type:-
  • Sensitivity:-
  • Supplier Device Package:40-QFN (6x6)
  • Data Rate ( Max):-
  • Memory Size:-
  • Voltage - Supply:-
  • Power - Output:-
  • Protocol:-
  • Serial Interfaces:-
  • R F Family/ Standard:-
  • Current - Receiving:-
  • Modulation:-
  • G P I O:-
  • Current - Transmitting:-
  • EU RoHS Status:Vendor omitted MSL Rating information
  • US ECCN:5A991G
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CYRF69213A-40LTXC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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