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1 : $1.3230
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Rochester Electronics CYPD1122-40LQXI
IC MCU 32BIT 32KB FLASH 40QFN
Manufacturer # :CYPD1122-40LQXI
Manufacturer :Rochester Electronics
Dasenic # :CYPD1122-40LQXI-DS
Datasheet :
CYPD1122-40LQXI Datasheet
CYPD1122-40LQXI DatasheetCustomer # :
Description : IC MCU 32BIT 32KB FLASH 40QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.3230 | $ 1.32 |
In Stock: 5490
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.323
Total :$ 1.32
Delivery :
Payment :
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CYPD1122-40LQXI information
Rochester Electronics CYPD1122-40LQXI technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers - Application Specific
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:40-UFQFN Exposed Pad
- Interface:I²C, SPI, UART/USART, USB
- Supplier Device Package:40-QFN (6x6)
- Voltage - Supply:1.71V ~ 5.5V
- Number of I/ O:34
- Core Processor:ARM® Cortex®-M0
- R A M Size:4K x 8
- Program Memory Type:FLASH (32kB)
- Controller Series:-
- Applications:USB Type C
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CYPD1122-40LQXI provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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