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1 : $1.2717
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Rochester Electronics CY8CTMA340-FNI-09
TRUE TOUCH MCU
Manufacturer # :CY8CTMA340-FNI-09
Manufacturer :Rochester Electronics
Dasenic # :CY8CTMA340-FNI-09-DS
Datasheet :
CY8CTMA340-FNI-09 Datasheet
CY8CTMA340-FNI-09 DatasheetCustomer # :
Description : TRUE TOUCH MCU
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 40+ | $ 1.2717 | $ 50.87 |
| 90+ | $ 1.0440 | $ 93.96 |
| 135+ | $ 1.0116 | $ 136.57 |
| 185+ | $ 0.9783 | $ 180.99 |
| 240+ | $ 0.9459 | $ 227.02 |
In Stock: 18472
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.2717
Total :$ 1.27
Delivery :
Payment :
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CY8CTMA340-FNI-09 information
Rochester Electronics CY8CTMA340-FNI-09 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Touch Screen Controllers
- Product Status:Active
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:49-UFBGA, WLCSP
- Current - Supply:-
- Interface:I²C, SPI
- Supplier Device Package:49-WLCSP (3.09x3.25)
- Touchscreen:2 Wire Capacitive
- Voltage - Supply:1.71V, 2.7V ~ 3.6V
- Resolution ( Bits):-
- Voltage Reference:Internal
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY8CTMA340-FNI-09 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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