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Rochester Electronics CY8CLED16P01-48LFXI
IC MCU 8BIT 32KB FLASH 48QFN
Manufacturer # :CY8CLED16P01-48LFXI
Manufacturer :Rochester Electronics
Dasenic # :CY8CLED16P01-48LFXI-DS
Datasheet :
CY8CLED16P01-48LFXI Datasheet
CY8CLED16P01-48LFXI DatasheetCustomer # :
Description : IC MCU 8BIT 32KB FLASH 48QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 23+ | $ 12.2490 | $ 281.73 |
In Stock: 1550
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 12.249
Total :$ 12.25
Delivery :
Payment :
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CY8CLED16P01-48LFXI information
Rochester Electronics CY8CLED16P01-48LFXI technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers - Application Specific
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:48-VFQFN Exposed Pad
- Interface:I²C, IrDA, SPI, UART/USART
- Supplier Device Package:48-QFN (7x7)
- Voltage - Supply:4.75V ~ 5.25V
- Number of I/ O:44
- Core Processor:M8C
- R A M Size:2K x 8
- Program Memory Type:FLASH (32kB)
- Controller Series:CY8CLED
- Applications:Powerline Communication
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY8CLED16P01-48LFXI provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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