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Rochester Electronics CY8CLED02-8SXI

IC MCU 8BIT 4KB FLASH 8SOIC
part number has RoHS
Manufacturer # :CY8CLED02-8SXI
Manufacturer :Rochester Electronics
Dasenic # :CY8CLED02-8SXI-DS
Customer # :
Description : IC MCU 8BIT 4KB FLASH 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.0880$ 2.09
25+$ 2.0520$ 51.3
100+$ 1.9620$ 196.2
500+$ 1.8810$ 940.5
1000+$ 1.7730$ 1773
In Stock: 1598
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.088
Total :$ 2.09
Delivery :
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Payment :
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CY8CLED02-8SXI information

  • Rochester Electronics CY8CLED02-8SXI technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microcontrollers - Application Specific
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Interface:I²C, IrDA, SPI, UART/USART
  • Supplier Device Package:8-SOIC
  • Voltage - Supply:2.4V ~ 5.25V
  • Number of I/ O:6
  • Core Processor:M8C
  • R A M Size:256 x 8
  • Program Memory Type:FLASH (4kB)
  • Controller Series:CY8CLED
  • Applications:HB LED Controller
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8542.31.0001
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY8CLED02-8SXI provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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